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BLT UFP-T4 Lead Free Fine Pitch solder paste
   BLT UFP-T4 Lead Free Fine Pitch solder paste (7200)

SAC305 >72 Hour tack life ultra fine pitch paste
12% flux
High print heat stability up to 30C  for one month
Unrefrigerated storage up to one month
Reduced voiding in BGA applications
 



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  • > Solder Pastes, Stencil Cleaners & Wipes > Stencil Cleaners

Downloads :
  • > Download LFSUFPT4 data.pdf

  • > Download LFSUFPT4 HS.pdf

     


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