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216 LT4 Vapour Phase solder paste
(7276)
Vapour Phase Solder Paste
LFS216 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing.
The superior wetting ability of LFS216 results in bright, smooth, shiny, solder joints. LFS216 offers very low post process residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys. LFS216 has shown to reduce or eliminate voiding under micro-BGAs. LFS216 also offers high humidity tolerance and a chemistry developed for use in air reflow. Slump and humidity tolerances found in LFS216 extend the solder pastes useable life in facilities where environmental control is not at its optimum. The SAC305 LT4 alloy contains a blend of two different alloys. SAC305 LT4 offers delayed wetting and allows both ends of the component extended time to thermally stabilize prior to being soldered, thus reducing tombstoning.
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Related Products :
SCS/1
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Downloads :
> Download LFS216LT-Tech.pdf
> Download LFS216LS-1H&S.pdf
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